Heating assembly, vaporizer, and electronic vaporization device

ABSTRACT

A heating assembly for a vaporizer is disclosed. The heating assembly includes a dense substrate having a liquid absorbing surface and a vaporization surface that are arranged opposite to each other, and a heating component disposed on the liquid absorbing surface. The dense substrate further includes a plurality of vertical holes and a plurality of transverse holes, the plurality of vertical holes run through the liquid absorbing surface and the vaporization surface, and the plurality of transverse holes communicate the plurality of vertical holes to prevent bubbles from blocking liquid supplying through the plurality of transverse holes, thereby further preventing dry burning.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of International Application No. PCT/CN2021/143260, filed on Dec. 30, 2021, the entire disclosure of which is hereby incorporated by reference.

TECHNICAL FIELD

This application relates to the field of electronic vaporization technologies, and in particular, to a heating assembly, a vaporizer, and an electronic vaporization device.

BACKGROUND

An electronic vaporization device is formed by components such as a heating body, a battery, and a control circuit. The heating body is a core component of the electronic vaporization device, and characteristics thereof decide a vaporization effect and use experience of the electronic vaporization device.

One type of the existing heating body is a cotton core heating body. Most cotton core heating bodies are in a structure of a spring-shaped metal heating wire wrapped on a cotton rope or a fiber rope. A to-be-vaporized liquid aerosol-generation substrate is absorbed by two ends of the cotton rope or fiber rope and then transmitted to the centered metal heating wire for heating and vaporization. Because an area of an end portion of the cotton rope or the fiber rope is limited, the absorption efficiency and the transmission efficiency of the aerosol-generation substrate are relatively low. In addition, the structure stability of the cotton rope or the fiber rope is poor. As a result, phenomena such as dry burning, carbon accumulation, and a burnt flavor are likely to occur after a plurality of times of thermal cycling.

Another type of the existing heating body is a ceramic heating body. In most ceramic heating bodies, a metal heating film is formed on a surface of a porous ceramic body. The porous ceramic body plays a role of liquid guiding and liquid storage, and the metal heating film heats and vaporizes the liquid aerosol-generation substrate. However, it is hard for a porous ceramic manufactured through high-temperature sintering to accurately control position distribution and size precision of micropores. To reduce a risk of liquid leakage, a hole diameter and a porosity need to be decreased, but to implement sufficient liquid supplying, the hole diameter and the porosity need to be increased, which conflict with each other. At present, with the hole diameter and the porosity meeting a condition of a low liquid leakage risk, a liquid guiding capability of a porous ceramic substrate is limited, and a burnt flavor is generated under a high power condition.

As technologies advance, requirements of a user on the vaporization effect of the electronic vaporization device become increasingly high. To meet the requirements of the user, a thin heating body is provided to improve a liquid supplying capability. However, bubbles are easily formed on a liquid absorbing surface of the thin heating body, which blocks liquid intaking and leads to dry burning of the heating body.

SUMMARY

This application provides a heating assembly, a vaporizer, and an electronic vaporization device, to resolve the technical problem that bubbles are easily formed on a liquid absorbing surface of a thin heating body in the related art.

To resolve the foregoing technical problem, a first technical solution provided in this application is to provide a heating assembly, including a dense substrate, where the dense substrate includes a liquid absorbing surface and a vaporization surface that are arranged opposite to each other, the dense substrate includes a plurality of vertical holes and a plurality of transverse holes, the plurality of vertical holes run through the liquid absorbing surface and the vaporization surface, and the plurality of transverse holes communicate the plurality of vertical holes.

The plurality of transverse holes include a plurality of first transverse holes extending in a first direction and a plurality of second transverse holes extending in a second direction, the second direction intersects with the first direction, and the first transverse holes and the second transverse holes are provided in different layers in a thickness direction of the dense substrate.

The plurality of transverse holes include a plurality of first transverse holes extending in a first direction and a plurality of second transverse holes extending in a second direction, the second direction intersects with the first direction, and the first transverse holes and the second transverse holes are provided in different layers in a thickness direction of the dense substrate.

Each of the plurality of vertical holes includes a first vertical hole segment close to the liquid absorbing surface and a second vertical hole segment close to the vaporization surface, and a hole diameter of the first vertical hole segment is different from a hole diameter of the second vertical hole segment.

The hole diameter of the first vertical hole segment at an end opening of the liquid absorbing surface is a first value, the hole diameter of the second vertical hole segment at an end opening of the vaporization surface is a second value, and the first value is greater than the second value.

In a direction from the vaporization surface to the liquid absorbing surface, the hole diameter of each of the plurality of vertical holes is gradually increased.

In a direction from the vaporization surface to the liquid absorbing surface, the hole diameter of each of the plurality of vertical holes is consistent.

A thickness of the dense substrate ranges from 0.1 mm to 1 mm.

A hole diameter of each of the plurality of vertical holes ranges from 1 μm to 100 μm.

A hole diameter of each of the plurality of transverse holes ranges from 1 μm to 100 μm.

A ratio of a thickness of the dense substrate to a hole diameter of each of the plurality of vertical holes ranges from 20:1 to 3:1.

A ratio of a distance between centers of adjacent vertical holes to a hole diameter of each of the plurality of vertical holes ranges from 3:1 to 5:1.

The heating assembly further includes a heating component, and the heating component is arranged on the vaporization surface.

To resolve the foregoing technical solution, a second technical solution provided in this application is to provide a vaporizer, including a liquid storage cavity and a heating assembly, where the liquid storage cavity is configured to store an aerosol-generation substrate; and the heating assembly is in fluid communication with the liquid storage cavity and configured to vaporize the aerosol-generation substrate, and the heating assembly is the heating assembly according to any one of the foregoing.

To resolve the foregoing technical solution, a third technical solution provided in this application is to provide an electronic vaporization device, including a vaporizer and a main unit, where the vaporizer is the vaporizer described above; and the main unit is configured to supply electric energy for operation of the vaporizer and control the heating assembly to vaporize the aerosol-generation substrate.

This application provides a heating assembly, a vaporizer, and an electronic vaporization device. The heating assembly includes a dense substrate, and the dense substrate includes a liquid absorbing surface and a vaporization surface that are arranged opposite to each other. The dense substrate includes a plurality of vertical holes and a plurality of transverse holes, the plurality of vertical holes run through the liquid absorbing surface and the vaporization surface, and the plurality of transverse holes communicate the plurality of vertical holes, to prevent bubbles from blocking liquid supplying through the plurality of transverse holes, thereby further preventing dry burning.

BRIEF DESCRIPTION OF THE DRAWINGS

To describe the technical solutions in embodiments of this application more clearly, the following briefly introduces the accompanying drawings required for describing the embodiments. Apparently, the accompanying drawings in the following description show merely some embodiments of this application, and a person of ordinary skill in the art may still derive other accompanying drawings from these accompanying drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of an electronic vaporization device according to this application;

FIG. 2 is a schematic structural diagram of a vaporizer according to an embodiment of this application;

FIG. 3 is a schematic structural diagram of a heating assembly according to an embodiment of this application;

FIG. 4 is a schematic structural diagram of the heating assembly provided in FIG. 3 from one side of a liquid absorbing surface;

FIG. 5 is a schematic perspective top structural view of the heating assembly provided in FIG. 3 ;

FIG. 6 is a schematic structural diagram of the heating assembly provided in FIG. 3 from one side of a vaporization surface;

FIG. 7 is a schematic structural diagram of an implementation of transverse holes and vertical holes inside the heating assembly provided in FIG. 3 ;

FIG. 8 is a schematic structural diagram of another implementation of transverse holes and vertical holes inside the heating assembly provided in FIG. 3 ;

FIG. 9 is a schematic structural diagram of still another implementation of transverse holes and vertical holes inside the heating assembly provided in FIG. 3 ; and

FIG. 10 is a schematic structural diagram of still another implementation of transverse holes and vertical holes inside the heating assembly provided in FIG. 3 .

DETAILED DESCRIPTION

The technical solutions in embodiments of this application are clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Apparently, the described embodiments are merely some rather than all of the embodiments of this application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the protection scope of this application.

In the following description, for the purpose of illustration rather than limitation, specific details such as the specific system structure, interface, and technology are proposed to thoroughly understand this application.

The terms “first”, “second”, and “third” in this application are merely intended for a purpose of description, and shall not be understood as indicating or implying relative significance or implicitly indicating the number of indicated technical features. Therefore, features defining “first”, “second”, and “third” can explicitly or implicitly include at least one of the features. In the description of this application, “a plurality of” means at least two, such as two and three unless it is specifically defined otherwise. All directional indications (for example, upper, lower, left, right, front, and rear) in the embodiments of this application are only used for explaining relative position relationships, movement situations, or the like between various components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications change accordingly. In the embodiments of this application, the terms “include”, “have”, and any variant thereof are intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but further optionally includes a step or unit that is not listed, or further optionally includes another step or component that is intrinsic to the process, method, product, or device.

“Embodiment” mentioned in this specification means that particular features, structures, or characteristics described with reference to the embodiment may be included in at least one embodiment of this application. The term appearing at different positions of this specification may not refer to the same embodiment or an independent or alternative embodiment that is mutually exclusive with another embodiment. A person skilled in the art explicitly or implicitly understands that the embodiments described in this specification may be combined with other embodiments.

This application is described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1 , FIG. 1 is a schematic structural diagram of an embodiment of an electronic vaporization device according to this application. In this embodiment, an electronic vaporization device 100 is provided. The electronic vaporization device 100 may be configured to vaporize an aerosol generation substrate. The electronic vaporization device 100 includes a vaporizer 1 and a main unit 2 that are electrically connected to each other.

The vaporizer 1 is configured to store an aerosol-generation substrate and vaporize the aerosol-generation substrate to form aerosols that can be inhaled by a user. The vaporizer 1 specifically may be applied to different fields such as medical care, cosmetology, and recreation inhalation. In a specific embodiment, the vaporizer 1 may be applied to an electronic aerosol vaporization device to vaporize an aerosol-generation substrate and generate aerosols for inhalation by an inhaler, and the following embodiments are described by using the recreation inhalation as an example. Certainly, in some other embodiments, the vaporizer 1 may also be applied to a hair spray device to vaporize hair spray used for hair styling; or applied to a device treating upper and lower respiratory system diseases to vaporize medicine.

For a specific structure and functions of the vaporizer 1, reference may be made to the specific structure and functions of the vaporizer 1 involved in any one of the following embodiments, same or similar technical effects may also be implemented, and details are not described herein again.

The main unit 2 includes a battery (not shown in the figure) and a controller (not shown in the figure). The battery is configured to supply electric energy to operation of the vaporizer 1, to cause the vaporizer 1 to vaporize the aerosol-generation substrate to form aerosols. The controller is configured to control operation of the vaporizer 1. The main unit 2 further includes other components such as a battery holder and an airflow sensor.

The vaporizer 1 and the main unit 2 may be integrally arranged or may be detachably connected to each other, which may be designed according to a specific requirement.

Referring to FIG. 2 , FIG. 2 is a schematic structural diagram of a vaporizer according to an embodiment of this application.

The vaporizer 1 includes a housing 10, a vaporization base 11, and a heating assembly 12. The housing 10 includes a liquid storage cavity 13 and an air outlet channel 14, where the liquid storage cavity 13 is configured to store a liquid aerosol-generation substrate, and the liquid storage cavity 13 is provided surrounding the air outlet channel 14. An inhalation opening 15 is further provided on an end portion of the housing 10, and the inhalation opening 15 is in communication with the air outlet channel 14. Specifically, an end opening of the air outlet channel 14 may form the inhalation opening 15. A holding cavity 16 is provided on one side of the liquid storage cavity 13 that is away from the inhalation opening 15 of the housing 10, and the vaporization base 11 is arranged in the holding cavity 16. The vaporization base 11 includes a vaporization top base 111 and a vaporization bottom base 112. The vaporization top base 111 cooperates with the vaporization bottom base 112 to form an accommodating cavity 113. That is, the vaporization base 11 includes the accommodating cavity 113. The heating assembly 12 is arranged in the accommodating cavity 113 and is arranged together with the vaporization base 11 in the holding cavity 16.

Two fluid channels 114 are provided on the vaporization top base 111. Specifically, the two fluid channels 114 are provided on a top wall of the vaporization top base 111, and the two fluid channels 114 are provided on two sides of the air outlet channel 14. One end of each of the fluid channels 114 is in communication with the liquid storage cavity 13, and the other end is in communication with the accommodating cavity 113. That is, the fluid channels 114 communicate the liquid storage cavity 13 and the accommodating cavity 113, so that the aerosol-generation substrate in the liquid storage cavity 13 enters the heating assembly 12 through the fluid channels 114. That is, the heating assembly 12 is in fluid communication with the liquid storage cavity 13, and the heating assembly 12 is configured to absorb and heat and vaporize the aerosol-generation substrate. The controller of the main unit 2 controls the heating assembly 12 to vaporize the aerosol-generation substrate.

In this embodiment, a surface of the heating assembly 12 that is away from the liquid storage cavity 13 is a vaporization surface, a vaporization cavity 115 is formed between the vaporization surface of the heating assembly 12 and an inner wall surface of the accommodating cavity 113, and the vaporization cavity 115 is in communication with the air outlet channel 14. An air inlet 116 is provided on the vaporization bottom base 112, so that the vaporization cavity 115 is in communication with the outside. External air enters the vaporization cavity 115 through the air inlet 116, carries aerosols vaporized by the heating assembly 12 to enter the air outlet channel 14, and finally reaches the inhalation opening 15 to be inhaled by the user.

The vaporizer 1 further includes a conductor 17, and the conductor 17 is fixed to the vaporization bottom base 112. One end of the conductor 17 is electrically connected to the heating assembly 12, and the other end is electrically connected to the main unit 2, so that the heating assembly 12 can work.

The vaporizer 1 further includes a sealing top cap 18. The sealing top cap 18 is arranged on a surface of the vaporization top base 111 that is close to the liquid storage cavity 13 and configured to implement sealing between the liquid storage cavity 13 and the vaporization top base 111 and the air outlet channel 14, to prevent liquid leakage. Optionally, a material of the sealing top cap 18 is silicone or fluoro rubber.

Referring to FIG. 3 to FIG. 5 , FIG. 3 is a schematic structural diagram of a heating assembly according to an embodiment of this application, FIG. 4 is a schematic structural diagram of the heating assembly provided in FIG. 3 from one side of a liquid absorbing surface, and FIG. 5 is a schematic perspective top structural view of the heating assembly provided in FIG. 3 .

The heating assembly 12 includes a dense substrate 121, and the dense substrate 121 includes a liquid absorbing surface 1211 and a vaporization surface 1212 that are arranged opposite to each other. The dense substrate 121 includes a plurality of vertical holes 1213 and a plurality of transverse holes 1214, the plurality of vertical holes 1213 are through holes running through the liquid absorbing surface 1211 and the vaporization surface 1212, and the plurality of transverse holes 1214 communicate the plurality of vertical holes 1213. The plurality of transverse holes 1214 cooperate with the plurality of vertical holes 1213 to form a mesh-shaped microfluidic channel. The vertical hole 1213 includes capillary force, and the aerosol-generation substrate is guided from the liquid absorbing surface 1211 to the vaporization surface 1212 through the vertical hole 1213. The mesh-shaped microfluidic channel may block bubbles from entering the liquid absorbing surface 1211 from the vaporization surface 1212, and prevent bubbles entering through adjacent vertical holes 1213 from being connected, namely, prevent the bubbles from growing up. Meanwhile, even if bubbles enter the liquid absorbing surface 1211 from the vaporization surface 1212 through the vertical holes 1213 and grow up when attached onto the liquid absorbing surface 1211 to block some vertical holes 1213, the transverse holes 1214 may supplement the aerosol-generation substrate to the blocked vertical holes 1213, to ensure in-time liquid supplying of the vaporization surface 1212, thereby preventing dry burning. The transverse hole 1214 further plays a role of liquid storage, to ensure that the transverse hole may not be burnt out for at least two times of inverse inhalation.

A material of the dense substrate 121 is glass, dense ceramic, or silicon. When the material of the dense substrate 121 is glass, the glass may be one of common glass, quartz glass, borosilicate glass, or photosensitive lithium aluminosilicate glass. In a specific implementation, the dense substrate 121 is borosilicate glass. In another specific implementation, the dense substrate 121 is photosensitive lithium aluminosilicate glass.

The dense substrate 121 may be in a shape of a plate, a cylinder, or an arc, which is specifically designed as required. For example, the dense substrate 121 of the heating assembly 12 provided in FIG. 4 is in a shape of a plate. The dense substrate 121 may be set to be in a regular shape, such as a rectangular plate shape or a circular plate shape. The plurality of vertical holes 1213 provided on the dense substrate 121 are arranged in an array. That is, the plurality of vertical holes 1213 provided on the dense substrate 121 are regularly arranged, and distances between centers of adjacent vertical holes 1213 among the plurality of vertical holes 1213 are the same.

Referring to FIG. 6 , FIG. 6 is a schematic structural diagram of the heating assembly provided in FIG. 3 from one side of a vaporization surface.

In this embodiment, as shown in FIG. 6 , the heating assembly 12 further includes a heating component 122, a positive electrode 123, and a negative electrode 124, where two ends of the heating component 122 are respectively electrically connected to the positive electrode 123 and the negative electrode 124. The positive electrode 123 and the negative electrode 124 are both arranged on the vaporization surface of the dense substrate 121 to be electrically connected to the main unit 2. The heating component 122 may be a heating sheet, a heating film, or a heating mesh, provided that the aerosol-generation substrate can be heated and vaporized. The heating component 122 may be arranged on the vaporization surface of the dense substrate 121 or may be buried inside the dense substrate 121, which is specifically designed as required.

In another implementation, the dense substrate 121 includes a conductive function and can generate heat by itself, such as conductive ceramic generating heat by itself or glass having a conductive function, and the heating component 122 does not need to be arranged in this case. That is, the heating component 122 is an optional structure.

In this implementation, the plurality of vertical holes 1213 are merely arranged on a part of the surface of the dense substrate 121 in an array arrangement manner. Specifically, the dense substrate 121 is provided with a microporous array region 1215 and a blank region 1216 provided surrounding a periphery of the microporous array region 1215, where the microporous array region 1215 includes the plurality of vertical holes 1213; the heating component 122 is arranged in the microporous array region 1215, to heat and vaporize the aerosol-generation substrate; and the positive electrode 123 and the negative electrode 124 are arranged in the blank region 1216 on the vaporization surface 1212, to ensure the stability of the electrical connection between the positive electrode 123 and the negative electrode 124.

By providing the microporous array region 1215 and the blank region 1216 provided surrounding the periphery of the microporous array region 1215 on the dense substrate 121, it may be understood that, no vertical hole 1213 is provided on the blank region 1216, thereby helping improve the intensity of the dense substrate 121 and reduce production costs. The microporous array region 1215 in the dense substrate 121 is used as a vaporization region to cover the heating component 122 and a region around the heating component 122, that is, basically cover regions reaching a temperature for vaporizing the aerosol-generation substrate, thereby fully utilizing the thermal efficiency.

It may be understood that, only when a size of a region around the microporous array region 1215 of the dense substrate 121 in this application is greater than a hole diameter of the vertical hole 1213, can the region be referred to as the blank region 1216. That is, the blank region 1216 in this application is a region in which vertical holes 1213 may be formed but no vertical hole 1213 is formed, rather than a region around the microporous array region 1215 and in which vertical holes 1213 cannot be formed. In an embodiment, it is considered that a blank region 1216 is provided in a circumferential direction of the microporous array region 1215 only when a gap between a vertical hole 1213 that is closest to a touchline of the dense substrate 121 and the touchline of the dense substrate 121 is greater than the hole diameter of the vertical hole 1213.

An extending direction of the vertical hole 1213 may be parallel to a thickness direction of the dense substrate 121, or may form an angle with the thickness direction of the dense substrate 121, where the angle ranges from 80 degrees to 90 degrees. A cross section of the vertical hole 1213 may be in a shape of a circle, and a shape of a vertical section and an extending direction of the vertical hole 1213 may be designed as required. In this embodiment, the vertical hole 1213 is a through hole parallel to the thickness direction of the dense substrate 121. That is, a central axis of the vertical hole 1213 is perpendicular to the liquid absorbing surface 1211.

A hole diameter of each vertical hole 1213 on the dense substrate 121 ranges from 1 μm to 100 μm. When the hole diameter of the vertical hole 1213 is less than 1 μm, the liquid supplying requirement cannot be met, leading to a decrease in an amount of aerosols; and when the hole diameter of the vertical hole 1213 is greater than 100 μm, the aerosol-generation substrate may easily leak out from the vertical hole 1213 to cause liquid leakage, leading to a decrease in the vaporization efficiency. It may be understood that, the hole diameter of the vertical hole 1213 is selected according to an actual requirement.

A hole diameter of each transverse hole 1214 ranges from 1 μm to 100 μm. When the hole diameter of the transverse hole 1214 is less than 1 μm, an effect of preventing the bubbles from entering the liquid absorbing surface 1211 cannot be well implemented; and when the hole diameter of the transverse hole 1214 is greater than 100 μm, the aerosol-generation substrate may leak easily, and there is a risk that the bubbles are transversely merged to grow up. Optionally, the hole diameter of the transverse hole 1214 ranges from 20 μm to 50 μm. It may be understood that, the hole diameter of the transverse hole 1214 is selected according to an actual requirement.

A thickness of the dense substrate 121 ranges from 0.1 mm to 1 mm. When the thickness of the dense substrate 121 is greater than 1 mm, the liquid supplying requirement cannot be met, leading to a decrease in the amount of aerosols. In addition, a caused heat loss is great, and costs for providing the vertical holes 1213 and the transverse holes 1214 are high. When the thickness of the dense substrate 121 is less than 0.1 mm, the intensity of the dense substrate 121 cannot be ensured, which is not conducive to improve the performance of the electronic vaporization device. Optionally, the thickness of the dense substrate 121 ranges from 0.3 mm to 0.7 mm. It may be understood that, the thickness of the dense substrate 121 is selected according to an actual requirement.

A ratio of the thickness of the dense substrate 121 to the hole diameter of the vertical hole 1213 ranges from 20:1 to 3:1, to improve the liquid supplying capability. When the ratio of the thickness of the dense substrate 121 to the hole diameter of the vertical hole 1213 is greater than 20:1, the aerosol-generation substrate supplied through capillary force of the vertical hole 1213 cannot met a vaporization required amount of the heating component 122, which easily leads to dry burning and a decrease in the amount of aerosols generated in single vaporization. When the ratio of the thickness of the dense substrate 121 to the hole diameter of the vertical hole 1213 is less than 3:1, the aerosol-generation substrate may easily leak out from the vertical hole 1213 to cause a waster, leading to a decrease in the vaporization efficiency and a decrease in a total amount of aerosols. Optionally, the ratio of the thickness of the dense substrate 121 to the hole diameter of the vertical hole 1213 ranges from 15:1 to 5:1.

A ratio of a distance between centers of two adjacent vertical holes 1213 to the hole diameter of the vertical hole 1213 ranges from 3:1 to 1.5:1, so that the intensity of the dense substrate 121 is improved as much as possible while causing the vertical holes 1213 on the dense substrate 121 to meet the liquid supplying capability. Optionally, the ratio of the distance between centers of two adjacent vertical holes 1213 to the hole diameter of the vertical hole 1213 ranges from 3:1 to 2:1. Further optionally, the ratio of the distance between centers of two adjacent vertical holes 1213 to the hole diameter of the vertical hole 1213 ranges from 3:1 to 2.5:1.

Referring to FIG. 7 , FIG. 7 is a schematic structural diagram of an implementation of transverse holes and vertical holes inside the heating assembly provided in FIG. 3 .

In an implementation, referring to FIG. 5 and FIG. 7 , the plurality of transverse holes 1214 include a plurality of first transverse holes 1214 a extending in a first direction and a plurality of second transverse holes 1214 b extending in a second direction, the first direction intersects with the second direction, and the plurality of first transverse holes 1214 a and the plurality of second transverse holes 1214 b are provided in a same layer in the thickness direction of the dense substrate 121. For example, a central axis of each of the plurality of first transverse holes 1214 a and a central axis of each of the plurality of second transverse holes 1214 b are approximately located in the same plane. Optionally, the first direction is perpendicular to the second direction.

Referring to FIG. 8 , FIG. 8 is a schematic structural diagram of another implementation of transverse holes and vertical holes inside the heating assembly provided in FIG. 3 .

In another implementation, the plurality of first transverse holes 1214 a and the plurality of second transverse holes 1214 b are provided in different layers in the thickness direction of the dense substrate 121. For example, the plurality of first transverse holes 1214 a and the plurality of second transverse holes 1214 b are provided at intervals in the thickness direction of the dense substrate 121. Compared with the arrangement manner in FIG. 7 , the plurality of first transverse holes 1214 a and the plurality of second transverse holes 1214 b are staggered in the thickness direction of the dense substrate 121, which helps improve the intensity of the dense substrate 121.

Referring to FIG. 3 , in this implementation, hole diameters of the plurality of vertical holes 1213 are consistent in a direction from the vaporization surface 1212 to the liquid absorbing surface 1211; and hole diameters of the plurality of transverse holes 1214 are consistent in an extending direction of each of the plurality of transverse holes 1214. An angle between a central axis of each of the plurality of transverse holes 1214 and a central axis of each of the plurality of vertical holes 1213 is greater than or equal to 70 degrees and less than or equal to 90 degrees. Optionally, the angle is 90 degrees. It may be understood that, the hole diameters of the plurality of vertical holes 1213 may be the same or may be different, which are designed as required. The hole diameters of the plurality of transverse holes 1214 may be the same or may be different, which are designed as required.

Referring to FIG. 9 and FIG. 10 , FIG. 9 is a schematic structural diagram of still another implementation of transverse holes and vertical holes inside the heating assembly provided in FIG. 3 , and FIG. 10 is a schematic structural diagram of still another implementation of transverse holes and vertical holes inside the heating assembly provided in FIG. 3 .

In an implementation, each of the plurality of vertical holes 1213 includes a first vertical hole segment 1213 a close to the liquid absorbing surface 1211 and a second vertical hole segment 1213 b close to the vaporization surface 1212, and a hole diameter of the first vertical hole segment 1213 a is different from a hole diameter of the second vertical hole segment 1213 b.

Specifically, the hole diameter of each of the plurality of vertical holes 1213 at an end opening of the liquid absorbing surface 1211 is a first value, the hole diameter of each of the plurality of vertical holes 1213 at an end opening of the vaporization surface 1212 is a second value, and the first value is greater than the second value. That is, the hole diameter of the first vertical hole segment 1213 a at the end opening of the liquid absorbing surface 1211 is greater than the hole diameter of the second vertical hole segment 1213 b at the end opening of the vaporization surface 1212. Through the foregoing arrangement, contact between the bubbles and a hole wall of a part of each of the plurality of vertical holes 1213 that is close to the liquid absorbing surface 1211 may be reduced, which helps bubble separation.

In a direction from the vaporization surface 1212 to the liquid absorbing surface 1211, the hole diameter of each of the plurality of vertical holes 1213 is gradually increased. In an implementation, the hole diameter of each of the plurality of vertical holes 1213 is continuously increased. For example, a vertical section of each of the plurality of vertical holes 1213 is in a shape of a trapezoid, namely, each of the plurality of vertical holes 1213 is a cone-shaped hole. In another implementation, as shown in FIG. 9 , the hole diameter of each of the plurality of vertical holes 1213 is increased in a stepped manner In this case, the first vertical hole segment 1213 a and the second vertical hole segment 1213 b each have an equal diameter, and by setting the hole diameter of the second vertical hole segment 1213 b to be less than the hole diameter of the first vertical hole segment 1213 a, contact between the bubbles and the hole wall is reduced, which helps bubble separation. In still another implementation, the first vertical hole segment 1213 a may be in a shape of a funnel, where a hole diameter of an end opening close to the second vertical hole segment 1213 b is equal to the hole diameter of the second vertical hole segment 1213 b, and a hole diameter of another part is greater than the hole diameter of the second vertical hole segment 1213 b, thereby reducing contact between the bubbles and the hole wall and helping bubble separation. For example, as shown in FIG. 10 , the first vertical hole segment 1213 a is in a shape of a round table, and the second vertical hole segment 1213 b is in a shape of a cylinder.

It may be understood that, each of the plurality of transverse holes 1214 may be a diameter-equal hole or may be a cone-shaped hole, provided that transverse liquid supplying can be implemented and bubble discharge can be facilitated, which is specifically designed as required.

The plurality of vertical holes 1213 on the heating assembly 12 provided in this application may be obtained through laser drilling, or may be obtained through laser induction first and corrosion when immersed in corrosion liquid. The plurality of transverse holes 1214 may be obtained through laser induction first and corrosion when immersed in corrosion liquid, and it may be understood that, no transverse hole 1214 is formed in the blank region 1216 in this manner.

The foregoing descriptions are merely implementations of this application, and the patent scope of this application is not limited thereto. All equivalent structure or process changes made according to the content of this specification and the accompanying drawings in this application or by directly or indirectly applying this application in other related technical fields shall fall within the protection scope of this application. 

What is claimed is:
 1. A heating assembly, comprising: a dense substrate comprising a liquid absorbing surface and a vaporization surface that are arranged opposite to each other, wherein the dense substrate comprises a plurality of vertical holes and a plurality of transverse holes, the plurality of vertical holes run through the liquid absorbing surface and the vaporization surface, and the plurality of transverse holes communicate the plurality of vertical holes; and a heating component disposed on the liquid absorbing surface.
 2. The heating assembly according to claim 1, wherein the plurality of transverse holes comprise a plurality of first transverse holes extending in a first direction and a plurality of second transverse holes extending in a second direction, the second direction intersects with the first direction, and the plurality of first transverse holes and the plurality of second transverse holes are provided in a same layer with respect to a thickness direction of the dense substrate.
 3. The heating assembly according to claim 1, wherein the plurality of transverse holes comprise a plurality of first transverse holes extending in a first direction and a plurality of second transverse holes extending in a second direction, the second direction intersects with the first direction, and the plurality of first transverse holes and the plurality of second transverse holes are provided in different layers with respect to a thickness direction of the dense substrate.
 4. The heating assembly according to claim 1, wherein each of the plurality of vertical holes comprises a first vertical hole segment close to the liquid absorbing surface and a second vertical hole segment close to the vaporization surface, and a hole diameter of the first vertical hole segment is different from a hole diameter of the second vertical hole segment.
 5. The heating assembly according to claim 4, wherein the hole diameter of the first vertical hole segment at an end opening of the liquid absorbing surface is a first value, the hole diameter of the second vertical hole segment at an end opening of the vaporization surface is a second value, and the first value is greater than the second value.
 6. The heating assembly according to claim 5, wherein in a direction from the vaporization surface to the liquid absorbing surface, the hole diameter of each of the plurality of vertical holes is gradually increased.
 7. The heating assembly according to claim 1, wherein the hole diameter of each of the plurality of vertical holes is consistent.
 8. The heating assembly according to claim 1, wherein a thickness of the dense substrate ranges from 0.1 mm to 1 mm.
 9. The heating assembly according to claim 1, wherein a hole diameter of each of the plurality of vertical holes ranges from 1 μm to 100 μm.
 10. The heating assembly according to claim 1, wherein a hole diameter of each of the plurality of transverse holes ranges from 1 μm to 100 μm.
 11. The heating assembly according to claim 1, wherein a ratio of a thickness of the dense substrate to a hole diameter of each of the plurality of vertical holes ranges from 20:1 to 3:1.
 12. The heating assembly according to claim 1, wherein a ratio of a distance between centers of adjacent vertical holes to a hole diameter of each of the plurality of vertical holes ranges from 3:1 to 5:1.
 13. A vaporizer, comprising: a liquid storage cavity configured to store an aerosol-generation substrate; and a heating assembly in fluid communication with the liquid storage cavity and configured to vaporize the aerosol-generation substrate, the heating assembly comprising: a dense substrate comprising a liquid absorbing surface and a vaporization surface that are arranged opposite to each other, wherein the dense substrate comprises a plurality of vertical holes and a plurality of transverse holes, the plurality of vertical holes run through the liquid absorbing surface and the vaporization surface, and the plurality of transverse holes communicate the plurality of vertical holes; and a heating component disposed on the liquid absorbing surface.
 14. The vaporizer according to claim 13, wherein the plurality of transverse holes comprise a plurality of first transverse holes extending in a first direction and a plurality of second transverse holes extending in a second direction, the second direction intersects with the first direction, and the plurality of first transverse holes and the plurality of second transverse holes are provided in a same layer with respect to a thickness direction of the dense substrate.
 15. The vaporizer according to claim 13, wherein the plurality of transverse holes comprise a plurality of first transverse holes extending in a first direction and a plurality of second transverse holes extending in a second direction, the second direction intersects with the first direction, and the plurality of first transverse holes and the plurality of second transverse holes are provided in different layers with respect to a thickness direction of the dense substrate.
 16. The vaporizer according to claim 13, wherein each of the plurality of vertical holes comprises a first vertical hole segment close to the liquid absorbing surface and a second vertical hole segment close to the vaporization surface, and a hole diameter of the first vertical hole segment is different from a hole diameter of the second vertical hole segment.
 17. The vaporizer according to claim 13, wherein a thickness of the dense substrate ranges from 0.1 mm to 1 mm.
 18. The vaporizer according to claim 13, wherein a hole diameter of each of the plurality of vertical holes ranges from 1 μm to 100 μm.
 19. The vaporizer according to claim 13, wherein a hole diameter of each of the plurality of transverse holes ranges from 1 μm to 100 μm.
 20. An electronic device, comprising: a vaporizer, comprising: a liquid storage cavity configured to store an aerosol-generation substrate; and a heating assembly in fluid communication with the liquid storage cavity and configured to vaporize the aerosol-generation substrate, the heating assembly comprising: a dense substrate comprising a liquid absorbing surface and a vaporization surface that are arranged opposite to each other, wherein the dense substrate comprises a plurality of vertical holes and a plurality of transverse holes, the plurality of vertical holes run through the liquid absorbing surface and the vaporization surface, and the plurality of transverse holes communicate the plurality of vertical holes; and a heating component disposed on the liquid absorbing surface; and a main unit, configured to supply electric energy for operation of the vaporizer and control the heating assembly to vaporize the aerosol-generation substrate. 